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| www..com SPECIFICATIONS FOR STANDARD LED LAMPS L 110 Series WENRUN OPTOELECTRONIC WENRUN LED Lamps www..com L 110 Series Features: High speed response. High reliability and long life. Low power consumption. Available in red,blue,white ,green, yellow colors. Suitable for pulse operation. Descriptions: The LED lamps are available with different colors,intensities,epoxy colors,etc. Superior performance in outdoor environment. Applications: These lamp are widely used for various application. Indication of all kinds. Commercial use. Selection Guide: Chip Part No. Material LG11010 LY11010 LSR11010 LI11010 GaP GaAsP/GaP GaAlAs GaAsP Emitting Color Green Yellow Super Red Orange Green Diffused Yellow Diffused Red Diffused Red Diffused Lens Type Prepared date June 2005 http://www.wenrun.com Rev. 3 Page 1of 5 WENRUN LED Lamps www..com L 110 Series Package Dimensions: 2.54 typ 18.0min 0.5 typ 1.5 max 2.0 5.0 1 2 1.0min 13.0min 1.5 3.0 3.8 5.6 1.ANODE 2.CATHODE NOTES 1 2 3 All dimensions are in millimetres (mm). Tolerance is 0.25mm(0.01") unless otherwise noted. Protruded resin under flange is 1.5mm Max LED. Absolute Maximum Rating Parameter Power Dissipation Pulse Forward Current IFP (Duty 1/10 @ 1kHz) Continuous Forward Current Reverse Voltage Operating Temperature Range Storage Temperature Range Soldering Temperature Notes Soldering time 5 seconds. IF VR Topr Tstg Tsol Ta=25 Green 60 Yellow 60 Super Red 50 Orange 60 Unit mW Symbol Pd 70 20 5 70 20 5 -30 -40 260 +85 70 20 5 70 20 5 mA mA V +100 5 Prepared date June 2005 http://www.wenrun.com Rev. 3 Page 2of 5 WENRUN LED Lamps www..com L 110 Series Electrical Optical Characteristics Green Yellow Typ. 4.5 Symbol Typ. Max. -- Ta=25 Super Red Typ. 8.5 Max. -Orange Unit Typ. 5.0 Max. -mcd Test Condition IF=20mA Parameter Luminous Intensity Forward Voltage Reverse Current Dominant Wavelength Peak Emission Wavelength Spectral Line Half Width Viewing Angle Max. -- IV 5.5 VF 2.2 2.5 2.0 2.5 1.85 2.3 2.0 2.5 V IF=20mA IR -- 50 -- 50 -- 50 -- 50 uA VR=5V d 565 -- 585 -- 645 -- 630 -- nm IF=20mA P 562 -- 588 -- 655 -- 636 -- nm IF=20mA 30 2 1/2 --- 30 140 --- 30 140 --- 30 140 --- nm deg IF=20mA IF=20mA 140 Reliability Test Items and Conditions NO Test Item -40 30min Test Conditions 25 5min 100 25 30min 5min Duration Sample Ac/Re 1 Temperature Cycle 50clycles 100 0/1 2 High Temp. Storage Ta=100 Ta=85 RH=85% Ta=-40 Ta=25 5 DC IF=20mA Tsol=260 5 10s 1000hours 100 0/1 3 Temp.& Humidity Test 1000hours 100 0/1 4 Low Temp. Storage 1000hours 100 0/1 5 Operating Life Test 1000hours 100 0/1 6 Solder Heat 1times 20 0/1 Prepared date June 2005 http://www.wenrun.com Rev. 3 Page 3of 5 WENRUN LED Lamps www..com L 110 Series Typical Electro-Optical Characteristics Curves Relative Luminous Intensity (%) 100 Relative Luminous Intensity Vs. Wavelength Ta=25 Forward Current (mA) 50 40 30 20 10 0 1.0 Forward Current Vs. Forward Voltage Ta=25 75 50 25 0 540 580 620 660 700 1.5 2.0 2.5 3.0 3.5 Wavelength (nm) Forward Voltage (V) Forward Current Vs Ambient Temperature 50 Relative Luminosity(%) Forward Current(mA) 40 30 20 10 0 0 20 40 60 80 100 Ambient Temperature Ta (C) 200 175 150 125 100 75 50 25 0 0 Forward Current Vs Relative Luminosity Ta=25 10 20 30 40 50 Forward Current (mA) Relative Luminosity Vs Ambient Temperature If=20mA 200 Relative Luminosity (%) -40 150 -50 -60 -70 50 0 0 20 40 60 80 100 Ambient Temperature Ta (C) -80 -90 1.0 0.5 -30 -20 -10 0 10 20 30 40 50 60 70 80 90 100 0 Radiation Angle 0.5 1.0 Prepared date June 2005 http://www.wenrun.com Rev. 3 Page 4of 5 WENRUN LED Lamps www..com L 110 Series Label Form Specification WENRUN OPTO. TYPE QUTY CODE DATE Lxxxxxx xxxxPCS xxxxxxxx xxxxxx Manufacturer Part No. Quantity Classing Code Sealing Date (year-month-day) Precautions In Use A Soldering Conditions 1 When soldering, leave the minimum clearance between the bottom of the resin and the soldering point. 2 Maximum allowable soldering conditions are. Solder dipping: 260 max., 5 seconds max., one time. Soldering iron: 350 max., 5 seconds max., one time. 3 Contact between molten solder and the resin must be avoided. 4 In soldering, do not put any stress on the lead frame, particularly when heated. B Lead frame Forming and Use 1 When forming leads ,the leads should be bent at a point at least 3mm from the base of epoxy. Lead forming should be done before soldering. 2 Do not apply any bending stress to the base of the lead. The stress to the base may damage the LEDs characteristics. 3 When mounting the LEDs onto a printed circuit board ,the holes on the circuit board should be exactly aligned with the leads of the LEDs. 4 Please avoid conditions which may cause the LED to corrode, tarnish or discolor. This corrosion or discoloration may cause difficulty during soldering operations. It is recommended that the LEDs be used as soon as possible. 5 Please avoid rapid transitions in ambient temperature, especially, in high humidity environments. Notes: 1 Above specification may be changed without notice. We will reserve authority on material change for above specification. 2 When using this product, please observe the absolute maximum ratings and the instructions for the specification sheets. We assume no responsibility for any damage resulting from use of the product which does not comply with the instructions included in the specification sheets. Prepared date June 2005 http://www.wenrun.com Rev. 3 Page 5of 5 |
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